发明名称 STRIPPING METHOD FOR RESIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a stripping method for a resin film of a resin film coating conductive wire which is excellent in stripping efficiency and capable of a high-speed peeling even if stripping width is large. SOLUTION: A planned stripping part of a conductive wire (an enameled wire) with a resin film is plastically deformed prior to electrolytic stripping, wherein stripping speed is improved significantly (for example, more than several times faster) in comparison with the case in which no plastic deformation is applied. By providing small holes and slits, and a conductor exposing part are on a resin film in the planned stripping part into which electrolyte can enter, further improvement in the stripping speed can be implemented.</p>
申请公布号 JP2002135936(A) 申请公布日期 2002.05.10
申请号 JP20000328490 申请日期 2000.10.27
申请人 DENSO CORP 发明人 SUZUKI KAZUYOSHI;HORIE YUKIJI;HAMADA MASATAKA
分类号 H02G1/12;H02K3/04;H02K15/04;(IPC1-7):H02G1/12 主分类号 H02G1/12
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