| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board excellent in connection and reliability by forming solder bumps having uniform shape and height in which defects like void are not present and mutual short circuits are not generated. SOLUTION: This method for manufacturing a multilayer printed wiring board is provided with steps (a), (b), (c) and (d). The step (a) is a first solder paste printing process wherein solder paste is printed at least one time, and recessed type apertures for forming solder bumps are filled with solder paste. The step (b) is a solder paste pressing process wherein the whole or a part of a solder paste layer on a solder resist layer is pressed. The step (c) is a solder paste flattening process wherein the surface of the solder paste buried by the steps (a) and (b) is made flat. The step (d) is a second solder paste printing process wherein printing of solder paste is performed one or more times.</p> |
