发明名称 METHOD AND APPARATUS FOR HOLDING SEMICONDUCTOR ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To prevent dust from sticking when a semiconductor element is sucked to be placed. SOLUTION: When placing an IC chip 12 by sucking and holding the chip by a suction nozzle 1, an air blowing nozzle 9 blows air toward the from of an opening of the suction nozzle 1.</p>
申请公布号 JP2002134589(A) 申请公布日期 2002.05.10
申请号 JP20000322042 申请日期 2000.10.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 INUZUKA RYOJI;SHIDA SATOSHI;YOSHIDA HIROYUKI
分类号 H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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