| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which giving a hardened matter excellent in fluidity, moldability, and solder crack resistance. SOLUTION: The epoxy resin composition for sealing the semiconductor contains following (a)-(d) essential compounds; (a) an epoxy resin component containing (a-1) 5-100 wt.% bisphenol epoxy resin represented by general formula (1) (wherein, R1 is H and a 1-3C hydrocarbon group; R2 is a phenol group, a naphthyl group or a biphenyl group which may be substituted with a 1-3C hydrocarbon group; R3 and R4 are a 1-3C hydrocarbon group; x and y are 0-4 integer; n is mean and indicates 0-1) and (a-2) 0-95 wt.% epoxy resin other than the bisphenol epoxy resin represented by general formula (1); (b) a phenolic hardener having two or more phenolic hydroxy groups per one molecule; (c) an inorganic filler; (d) an accelerator.
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