发明名称 SENSOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a sensor module with easily manufacturing and assembling that can be miniaturized. SOLUTION: A case 1 integrated with a lens is formed by a lens part 11 with a dome shape and a cylindrical case part 12 that integrally stretches from the lower end of the lens part 11. A sensor 2 is mounted on the upper surface of an attachment plate 3, and a plurality of terminals 21, 22, 23 of the sensor 2 are passed through the plate 3 and a circuit substrate 4 to be projected below and is connected to a circuit element mounted on the substrate 4 at the penetration part of the substrate 4. The sensor 2 is housed in the case 1, and an opening at the lower end of the case 1 is covered with an under plate 5. The terminals 21, 22, 23 are passed through the plate 5 to be projected below. A rib stopper 12a that controls a store position of the sensor 2 is placed inside the case 1. A spacer 31, which has a through hole 31a that the terminals of the sensor 2 can be fitted on the under surface of the plate 3 and controls a space between the plate 3 and the substrate 4, is formed. The hole 31a is formed to a hole with a smaller diameter than diameters of the terminals 21, 22, 23, and the terminals 21, 22, 23 are pressed into the hole 31a.
申请公布号 JP2002131446(A) 申请公布日期 2002.05.09
申请号 JP20000320481 申请日期 2000.10.20
申请人 SEIKO PRECISION INC 发明人 AMAKASU MIKIO
分类号 G01V8/12;G01J1/02;G01J1/04;G08B13/19;(IPC1-7):G01V8/12 主分类号 G01V8/12
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