METHOD FOR VIBRATION PLATING OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for vibration plating of electronic components which controls a thickness distribution of plated film for an electrode by adequately vibrating and agitating electronic elements and media. SOLUTION: The method for vibration plating of electronic components which plates ceramic elements 1 by accommodating ceramic elements 1 and media 25 (for current carrying) in a basket 11 provided with an electrode 23 for plating, and by passing current to the electrode 23 for plating while immersing the basket 11 in a plating solution tank 27 and vibrating the basket, is characterized by controlling a total input of the ceramic elements 1 and media 25 so as to be height d of 3-30 mm from a bottom 11b of the basket 11.