发明名称 |
POLISHING METHOD AND POLISHING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To automatically measure polishing efficiency in a polishing process. SOLUTION: A sensor 1 provided on this polishing device injects a fluid such as pure water into the layer of an abrasive pad 3 and measures a nozzle opening section pressure and a flow. An information processing device 9 calculates the passage resistance in the layer of the abrasive pad 3 from a nozzle opening section pressure signal 15 and a flow signal 14 obtained by the sensor 1 and converts the calculated passage resistance into polishing efficiency by using a prescribed table. The polishing performance of the abrasive pad 3 varying as polishing progresses is evaluated by using the detected polishing efficiency. The evaluated result is utilized for determining the execution timing of a dressing treatment to the abrasive pad and the replacing timing of the abrasive pad and for correcting the polishing time of a work. |
申请公布号 |
JP2002126996(A) |
申请公布日期 |
2002.05.08 |
申请号 |
JP20000323764 |
申请日期 |
2000.10.24 |
申请人 |
HITACHI LTD |
发明人 |
KOJIMA HIROYUKI;SATO HIDEMI;OKAWA TETSUO |
分类号 |
B24B53/00;B24B53/017;H01L21/304 |
主分类号 |
B24B53/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|