发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To automatically measure polishing efficiency in a polishing process. SOLUTION: A sensor 1 provided on this polishing device injects a fluid such as pure water into the layer of an abrasive pad 3 and measures a nozzle opening section pressure and a flow. An information processing device 9 calculates the passage resistance in the layer of the abrasive pad 3 from a nozzle opening section pressure signal 15 and a flow signal 14 obtained by the sensor 1 and converts the calculated passage resistance into polishing efficiency by using a prescribed table. The polishing performance of the abrasive pad 3 varying as polishing progresses is evaluated by using the detected polishing efficiency. The evaluated result is utilized for determining the execution timing of a dressing treatment to the abrasive pad and the replacing timing of the abrasive pad and for correcting the polishing time of a work.
申请公布号 JP2002126996(A) 申请公布日期 2002.05.08
申请号 JP20000323764 申请日期 2000.10.24
申请人 HITACHI LTD 发明人 KOJIMA HIROYUKI;SATO HIDEMI;OKAWA TETSUO
分类号 B24B53/00;B24B53/017;H01L21/304 主分类号 B24B53/00
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