| 摘要 |
Production of solder connections comprises applying a soluble galvanizing base layer to a solder surface and a passivating layer (4) to a semiconductor wafer (1); applying a structured lacquer or polyimide mask to the galvanizing base layer; depositing a metal layer within an opening in the mask; and dissolving the remaining base layer on the passivating layer. Preferred Features: The metals of the base layer are components of solder systems made up of two or more types of metal. The opening in the mask is larger than the opening in the passivating layer. The opening in the mask is circular or elliptical. After removing the mask, the exposed base layer is etched. |
