发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent development of cracks at the machining place, while preventing depositing of debris and dross onto the machining place and the vicinity thereof by a simple method. SOLUTION: While spraying dry mist DM of water produced by a ultrasonic wave oscillator 24 directing toward the opposite side face to the laser irradiation face of a work W, a laser beam L is radiated by a YAG laser beam device. When the surface and the back face are penetrated by the laser beam L, the dry mist stuck on each face or present in the vicinity thereof is vaporized by the heat caused by the laser beam machining, and the volume thereof is expanded rapidly. By this expansion, the debris and dross produced by the laser beam machining are blown off to splash in the atmosphere or float in the dry mist not vaporized. And the expansion of volume of the dry mist, when vaporized, is smaller than that of a fluid (water), and the impact on the work is smaller than that in the case of the water.</p>
申请公布号 JP2002126891(A) 申请公布日期 2002.05.08
申请号 JP20000324937 申请日期 2000.10.25
申请人 RICOH MICROELECTRONICS CO LTD 发明人 KINOSHITA SHINGEN
分类号 B28D5/04;B23K26/16;(IPC1-7):B23K26/16 主分类号 B28D5/04
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