| 摘要 |
PROBLEM TO BE SOLVED: To provide a new braze-jointing method between metals capable of essentially eliminating a failure factor accompanying the conventional Sn-Pb soldering in place of the soldering method using a soldering material not containing lead. SOLUTION: As a brazing material, a metal whose mean particle diameter is 100 nm or less, e.g. a noble metal or a hyper fine grain of copper is used, the surface thereof is covered with an amine compound having an end amine group, an acid anhydride, etc., capable of reacting with the amine compound having the end amine group when heated is added to the dispersion liquid in an appropriate quantity as a metal coloid dispersion liquid dispersed evenly in an organic solvent. The material is heated up to the same degree of temperature as the soldering temperature, and by making mutual dispersion fusion in the contact boundary face between the bulk metal surface and the hyper fine grain, and fusion among the hyper fine grains, the jointed layer is formed. |
