发明名称 |
WAFER DROP PREVENTING APPARATUS OF BAKE APPARATUS FOR SEMICONDUCTOR FABRICATION |
摘要 |
PURPOSE: A wafer drop preventing apparatus of a bake apparatus for semiconductor fabrication is provided, which prevents a wafer drop when a robot removes a wafer with a main arm by preventing a shift of the wafer by an air current when the wafer is placed on a wafer bake plate. CONSTITUTION: A plurality of ceramic balls(20,22,24) supports a bottom of a wafer(10) in a chamber and are installed on an upper surface of a plate(12). And a plurality of transportation pins(14,18) moving up and down are installed to load and unload the wafer. In order to deposit a photo resist, the wafer is placed on the transportation pins by increasing the transportation pins to the upward. Then, if the photo resist is deposited on the wafer, the transportation pins are decreased and the wafer is placed on the ceramic balls. Even if an air current is generated in the chamber, the wafer is not shifted because the wafer is placed on the plurality of ceramic balls, and therefore a drop of the wafer is prevented when a robot removes the wafer with a main arm.
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申请公布号 |
KR20020034050(A) |
申请公布日期 |
2002.05.08 |
申请号 |
KR20000064838 |
申请日期 |
2000.11.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAN, GWANG YUN;KIM, GIL YONG;KIM, SU HYEON;LIM, TAE MIN |
分类号 |
H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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