Substrateless chip scale package and method of making same

摘要

The present invention relates to a chip scale package and a method for providing the same. The chip scale package reduces the length of interconnection through the direct contact of a semiconductor chip and output terminals without a substrate. The chip scale package includes a semiconductor chip in which electronic circuits are integrated, having several bonding pads on an upper side. Output terminals are disposed around the semiconductor chip. Bonding wires connect the bonding pads with the output terminals. The bonding wires and associated components are encapsulated by a molded material, which does not encapsulate the central base of the semiconductor chip and the output terminals.