发明名称 |
Method of manufacturing fine pattern and printed circuit board manufactured with this method |
摘要 |
A method of manufacturing fine pattern of the invention comprises (a) a step of manufacturing a master substrate having a film of precious metal or an alloy thereof formed as an insoluble electrode on the electrode, (b) a step of forming a fine pattern film on the insoluble electrode with anion type electro-deposition, and (c) a step of exfoliating and transferring the fine pattern film onto another substrate. Another method of manufacturing fine pattern further includes a step of manufacturing a master substrate, of which a surface is provided with at least a repeatedly reproducible sacrificial electrode. Still another method of manufacturing fine pattern includes a step of forming a pattern electrode on a conductive substrate by electro-forming, and transferring the electrode onto another substrate. Yet another method of manufacturing fine pattern includes a structure wherein a transparent section is provided in a portion of a master substrate in order to facilitate a positional alignment. The invention provides reliable and accurate mass production of fine-line and high-density films of fine pattern having good transfer ability and durability at low cost. A fine-line and high-density printed circuit board can be made at low cost with the methods of manufacturing fine pattern as disclosed above.
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申请公布号 |
US6383720(B1) |
申请公布日期 |
2002.05.07 |
申请号 |
US19990376357 |
申请日期 |
1999.08.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NAKASHIMA KOJI;YOSHINO TOYOKAZU;KAMIZURU SHINOBU |
分类号 |
H05K3/20;(IPC1-7):C25D9/06 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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