METHOD FOR ATTACHING THIN FILM TO THIN BOARD BY USING DENDRITE INTERCONNECTION

摘要

PURPOSE: A method for attaching thin film to thin board is provided to obtain high quality package and reduce manufacturing cost by allowing thin film wiring layers to be easily attached onto the organic wiring board. CONSTITUTION: An interconnection assembly comprises a multi-layer thin film(16) having an upper surface and a lower surface with at least one connection electrode; and a board including a surface having at least one board connection electrode, wherein the surface of the board is coated with a joining material, and the joining material forms a junction between the thin film and the board under a predetermined treatment condition. The upper surface of the thin film is coated with an adhesive material(14) fixed to a carrier plate(12). The board connection electrode is surrounded by a solder mask(26a).