| 摘要 |
PURPOSE: A semiconductor package is provided to reduce the size of the semiconductor package by lessening a length of wires. CONSTITUTION: A semiconductor chip(20) includes an integrated circuit on one side of the semiconductor chip(20) and chip pads(22) for withdrawing signals from the integrated circuit. Leads(16) respectively having a convex and a concave on the surface and the rear surface of the lead(16) are located on defined regions having an interval from the semiconductor chip(20) and bonding pads(18) are respectively fixed on the leads(16). At this point, a length of wires(24) between the chip pads(22) and the bonding pads(18) is lessened by the convex portion of the lead(16). A mold compound(26) covers the semiconductor chip(20), the wires(24) and the leads(16) in order to protect the package from the surroundings. |
