PICKUP TOOL FOR ADHERING SEMICONDUCTOR CHIP

摘要

PURPOSE: A pickup tool for adhering a semiconductor chip is provided to adhere a semiconductor chip in parallel on a chip loading region by forming a member of a bottom edge portion of the pickup tool and a support plate for supporting the member with one body. CONSTITUTION: A vacuum hole(12) is formed on a center of a bottom face of a pickup tool(10a). A projection(14) is formed around the vacuum hole(12). The projection(14) is closely contacted with a semiconductor chip. A support plate(16) is formed on a bottom edge portion of the pickup tool(10a). A slit(18) for controlling air flow is formed on all sides of the support plate(16) of the pickup tool(10a). A chip loading region of a member is maintained in parallel since the support plate(16) of the pickup tool(10a) is closely contacted with the member in order to support the member horizontally.