| 摘要 |
<p>A device and a method for plating; the device for electroless plating capable of reducing the consumed amount of plating fluid, maintaining a stable plating process, reducing the size and cost thereof, uniformizing an inplane film thickness, and preventing the plating fluid from being deteriorated due to a rise in temperature, comprising a holder (11) for holding a substrate with a plated surface facing upward, a plating fluid holding mechanism (31) for sealing the periphery of the plated surface of the substrate (W) held by the holder (11), an electroless plating treatment fluid feeder (41) for feeding and accumulating the electroless plating treatment fluid to and on the plated surface of the substrate sealed by the plating fluid holding mechanism (31), and a heating device (15) installed on the underside of the substrate.</p> |
