发明名称 Thermal management device
摘要 A miniature vapor compression cycle thermal management device with a dropwise condenser. The device of the invention includes a flexible compressor diaphragm serving as the compressive member in a compressor. The compressor is stimulated electrostatically and drives the relatively small refrigerant charge for the device through a closed loop defined by interconnected compressor, condenser, expansion, and evaporator structures. The condenser includes a flexible condenser diaphragm for propelling condensed droplets of refrigerant from a cooled condensing surface into an expansion chamber. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 C.F.R. §1.72(b).
申请公布号 US2002050148(A1) 申请公布日期 2002.05.02
申请号 US20010874656 申请日期 2001.06.04
申请人 SHYY WEI;FRANCOIS MARIANNE MONIQUE;CHUNG JACOB NAN-CHU 发明人 SHYY WEI;FRANCOIS MARIANNE MONIQUE;CHUNG JACOB NAN-CHU
分类号 F04B43/04;F25B1/02;F25B39/04;H01L23/427;(IPC1-7):F25B1/00 主分类号 F04B43/04
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