| 摘要 |
An out-of-plane microcoil (e.g., inductor) including conductive traces formed on a substrate, and then connecting the conductive traces using standard wire bonding techniques. The conductive traces of each microcoil include first and second spaced-apart contact pads, and an elongated interconnect line located between the first and second contact pads. Wire bonding is then performed to place a first wire such that the wire extends from the first contact pad over the substrate surface to a first end of the interconnect line, and to place a second wire such that the wire extends from the second contact pad over the substrate to a second end of the interconnect line. The conductive traces are formed during the final metallization step typically used to form device contact pads on the IC substrate. The wires are placed during, for example, device packaging (i.e., connection of the IC substrate to package terminals). Modern ICs typically require dozens to hundreds of such bonding wires, so the addition of a few wires to produce out-of-plane microcoils does not significantly increase the packaging time or expense. <IMAGE> |
