发明名称 |
Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
摘要 |
A Pb-free solder is provided, which has a satisfactory low melting point and suppresses effectively the "copper leaching" phenomenon. The solder is difficult to be oxidized and has a high wettability. The solder consists essentially of (a) 1.0 to 4.0 wt% of Ag, (b) 0.4 to 1.3 wt% of Cu; (c) at least one of 0.02 to 0.06 wt% (or 0.02 to 0.04 wt%) of Ni and 0.02 to 0.06 wt% (or 0.02 to 0.05 wt%) of Fe; and (d) a balance of Sn. The solder has a copper dissolution rate of 0.20 or 0.15 mu m or less. Preferably, the solder has a liquidus temperature of 240 DEG C or lower, in which a satisfactory low melting point is ensured. More preferably, the solder has a liquidus temperature of 230 DEG C or lower. It is preferred that the solder has a viscosity of 2.5 cP or lower. <IMAGE> |
申请公布号 |
EP1088615(A3) |
申请公布日期 |
2002.05.02 |
申请号 |
EP20000121429 |
申请日期 |
2000.09.29 |
申请人 |
NEC CORPORATION;SOLDER COAT CO., LTD. |
发明人 |
ITO, TOSHIHIDE;HARA, SHIRO |
分类号 |
B23K35/26;C22C13/00;H05K3/24;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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