Automatic polishing apparatus capable of polishing a substrate with a high planarization

摘要

An automatic polishing apparatus has an index table. A loading station, a primary polishing station, a secondary polishing station, and an unloading station are set along the circumference of an index table. The index table has a plurality of holders 2 each of which is for supporting a wafer. The index table is rotated so that rotational movement is given to each of the stations. The wafer is transferred to the loading station. The wafer is transferred from the loading station to the primary polishing station to be subjected to planarization process at the primary polishing station. The wafer is is subject to finish treatment at the secondary polishing station to be polished into a polished wafer which is transferred from the unloading station to an outside of the polishing apparatus.