发明名称 Ceramic electronic component
摘要 A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 mum.
申请公布号 US6381117(B1) 申请公布日期 2002.04.30
申请号 US20000656724 申请日期 2000.09.07
申请人 MURATA MANUFACTURING CO., LTD. 发明人 NAKAGAWA TAKUJI;TAKAGI YOSHIKAZU;YONEDA YASUNOBU;WATANABE TORU
分类号 H01G4/12;H01G2/14;H01G4/232;H01G4/30;H05K3/34;(IPC1-7):H01G4/228;H01G4/20;H01G4/06 主分类号 H01G4/12
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