发明名称 |
Damascene anti-fuse with slot via |
摘要 |
Interconnect structures comprising a substrate having a first level of electrically conductive features formed thereon; a patterned interlevel dielectric material formed on said substrate, wherein said patterned interlevel dielectric includes via spaces, wherein at least one of said via spaces is a slot via in which an anti-fuse material is formed on a portion thereof; and a second level of electrically conductive features formed in said spaces, whereby the anti-fuse material in the slot via provides a connection between the first and second levels of electrically conductive features and a method of fabricating the same.
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申请公布号 |
US6380003(B1) |
申请公布日期 |
2002.04.30 |
申请号 |
US19990469374 |
申请日期 |
1999.12.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JAHNES CHRISTOPHER V.;NARAYAN CHANDRASEKHAR;RADENS CARL J. |
分类号 |
H01L21/768;H01L23/525;(IPC1-7):H01L21/82;H01L21/44;H01L21/476;H01L29/00 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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