| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for an electronic part with lead wires, which can reduce the rate of waste electronic parts caused by deformed lead aires. SOLUTION: The shape of each lead wire 6a of an electronic part 6 sucked in by vacuum to the nozzle 12 of a suction head 11, is measured by a CCD camera 20 and a laser unit 21, and the result of the measurement is judged by a pass-fail judging means whether or not it is acceptable. Parts are not abandoned except definitely defective parts and are mounted onto a substrate 7 as they are, and a discrimination mark is printed by a marker 15 onto any electronic part judged to be a defective one. After a reflow has been over, any electronic part printed with a discrimination mark, is visually and accurately inspected, and when its lead wires are found to be correctable, they can be corrected using a jig, and the non-defective rate of the electronic parts can thereby be enhanced. |
