发明名称 Method and device for treating substrates
摘要 In a method for treating substrates, the substrates are lowered for treatment into a treatment fluid contained in a treatment device. The substrates are then lifted by a first receiving device at least partially out of the treatment fluid and transferred to a second receiving device for completely lifting the substrates out of the treatment fluid. The second receiving device is completely dry at the time of transfer. The drops forming at the lowest point of the substrates are drained during lifting by a drop draining element. The device for performing the method has a lifting device with a first and second receiving device and a drop draining device for draining the drops forming at the lowest point of the substrates during lifting of the substrates from the treatment fluid.
申请公布号 US6379470(B2) 申请公布日期 2002.04.30
申请号 US19990284035 申请日期 1999.04.01
申请人 STEAG MICROTECH GMBH 发明人 SCHOENLEBER DIETMAR
分类号 G02F1/13;B08B3/04;B65G49/07;F26B11/22;H01L21/00;H01L21/304;(IPC1-7):B08B7/04 主分类号 G02F1/13
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