发明名称 Segmented wafer polishing pad
摘要 Working plate (10) is formed of forty-eight sections (10'), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10') attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19).
申请公布号 AU9574901(A) 申请公布日期 2002.04.29
申请号 AU20010095749 申请日期 2001.10.19
申请人 H K FOUNDERS LTD 发明人 STEPHEN VICTOR MIDDLETON;JOHN EDMUND LEIGH KRUGER
分类号 B24B37/26;B24D7/06 主分类号 B24B37/26
代理机构 代理人
主权项
地址