| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency carrier, which improves the efficiency of interconnection in signal transmission. SOLUTION: A high frequency carrier 230 is provided with a flat ceramic substrate 231 having a first side and a second side and at least one feed through extended from the first side to the second side. The feed through has a doped pedestal 236 of a semiconductor surrounded with a conductive metal layer partially at least. Besides, the electric assembly has the high frequency carrier 230 and a metallized substrate 201. The first side of the carrier 230 is attached to the metallized substrate 201 so that the feed through can be electrically connected with the metallized substrate 201. Besides, the electric assembly has at least one electronic element 300 (such as electronic component or electric circuit) attached on the second side of the carrier 230 and the electronic element 300 is electrically connected to the feed through. |
