WIRING METHOD FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a wiring method for a semiconductor package which can decrease the man-hour needed for wiring design and design wiring between terminals at optimum intervals. SOLUTION: This method includes a step where wiring routes connecting via parts 12 individually are roughly wired with segments, a step where a wiring pattern 16 is generated by molding so that the segments do not interfere with one another and have optimum wiring intervals, a step where a fine segment 15 shorter than specific length at the molded wiring part is scanned and searched for and deleted, and a step where the wiring pattern 16 is corrected by redrawing a segment so that the wiring ends having the fine segment 15 deleted are electrically connected.