CIRCUIT ELEMENT MOUNTING SUBSTRATE AND MOUNTING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To prevent the phenomenon of short-circuit between electrodes provided on a circuit element from being generated even though silver pastes are used for mounting the element on wiring circuits. SOLUTION: Wiring circuits 2 mounted with a circuit elements 4 are provided on a substrate 1, and an insulating resin layer 6 having a thickness to fill a gap between the element 4 mounted on the circuits 2 and the substrate 1 is formed on the substrate 1 between the circuits 2 with a width roughly two times wider than that of the element 4. This layer 6 is formed of a resin of a curing speed quicker than that of silver pastes 5 and is cured and formed simultaneously with the pastes 5 in a curing process for the pastes 5.