| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment and method of pasting a tape on a semiconductor wafer, which can keep the adhesion between the tape and the semiconductor wafer at a sufficient level and can suppress separation of a semiconductor chip or semiconductor device from the tape. SOLUTION: The tape pasting equipment 10 for a semiconductor wafer comprises a winding tape roll 3 for taking up a tape 2 wound around a tape roll 1, tapered roller 4 whose diameter becomes gradually smaller towards both ends, a wafer table 7 to place and position a semiconductor wafer 6 taken out of a wafer carrier station 5, an orientation flat cutter 8, and a peripheral cutter 9. |
