发明名称 BUS BAR AND MOUNTING STRUCTURE FOR ELECTRONIC OR ELECTRICAL COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a bus bar and a mounting structure for electronic or electrical components, which assure proper surface contact for electronic components, having a protrusion on a connection face due to mold resin, at manufacturing. SOLUTION: A convex face 3 with the extent of protrusion being higher than that of a jut 10a formed on a rear face 11 of the electronic component 8 is fitted to a mounting face 2 for a bus bar 1, with which the electronic component 8 is connected. Using this, sufficient plane contact is obtained between the electronic component 8 and the bus bar 1, which gives rise to stable electrical as well as thermal conductivity between the electronic component 8 and the bus bar 1, hence improving the reliability of a product.</p>
申请公布号 JP2002124313(A) 申请公布日期 2002.04.26
申请号 JP20000319352 申请日期 2000.10.19
申请人 SONY CORP 发明人 SASAKI AKIRA;ODAJIMA YOSHIHIRO
分类号 H01R4/34;H01L23/36;H02G3/16;H05K7/06;H05K7/20;(IPC1-7):H01R4/34 主分类号 H01R4/34
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