摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bus bar and a mounting structure for electronic or electrical components, which assure proper surface contact for electronic components, having a protrusion on a connection face due to mold resin, at manufacturing. SOLUTION: A convex face 3 with the extent of protrusion being higher than that of a jut 10a formed on a rear face 11 of the electronic component 8 is fitted to a mounting face 2 for a bus bar 1, with which the electronic component 8 is connected. Using this, sufficient plane contact is obtained between the electronic component 8 and the bus bar 1, which gives rise to stable electrical as well as thermal conductivity between the electronic component 8 and the bus bar 1, hence improving the reliability of a product.</p> |