| 发明名称 |
Semiconductor device package and lead frame with die overhanging lead frame pad |
| 摘要 |
Semiconductor die are soldered or epoxy bonded to lead frame pads and overhang the pads to reduce thermal differential expansion and contraction stresses applied to the die from the lead frame pad. A plastic housing of standard size is unchanged in dimension, but contains a greater total silicon die area. |
| 申请公布号 |
US2002047198(A1) |
申请公布日期 |
2002.04.25 |
| 申请号 |
US20010002252 |
申请日期 |
2001.10.26 |
| 申请人 |
INTERNATIONAL RECTIFIER CORP. |
发明人 |
SAMMON TIM |
| 分类号 |
H01L25/18;H01L21/52;H01L23/12;H01L23/28;H01L23/48;H01L23/495;H01L23/50;H01L25/04;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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