| 发明名称 |
Lead frame laminate and method for manufacturing semiconductor parts |
| 摘要 |
A lead frame laminate for use in manufacturing semiconductor parts is provided. A lead frame has an opening and a copper terminal portions formed in the opening. A base material film covers at least the opening and the terminal portions, and laminated on the lead frame through an adhesive layer. The adhesive layer contains a silicone binder and an oxidation inhibitor. |
| 申请公布号 |
WO0193328(A3) |
申请公布日期 |
2002.04.25 |
| 申请号 |
WO2001JP04563 |
申请日期 |
2001.05.30 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
FURUTA, YOSHIHISA;NABATA, NORIKANE;TAKANO, HITOSHI |
| 分类号 |
C09J7/02;C09J183/04;H01L21/56;H01L23/495;H01L23/50 |
主分类号 |
C09J7/02 |
| 代理机构 |
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