Plate lamella packet for electrical machines, has stacked plate lamellas and heat conducting layer mounted flat on plate lamella of thermal conductivity greater than that of plate lamellas

摘要

The device has several plate lamellas (2) arranged one flat on top of the other and at least one heat conducting layer (6) mounted flat on a plate lamella, whereby the thermal conductivity of the heat conducting layer is greater than that of the plate lamellas. The heat conducting layer consists of aluminum, copper, silver, gold or an alloy containing these constituents.