发明名称 Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path.
摘要 A heat conductor path runs partly in an intermediate layer (11,12) conveying heat crosswise. A component (3) and a cooling element (6) are connected to the intermediate layer by electro-plating. The electro-plated contact forms a metal thermal through-contact (16).
申请公布号 DE10127268(A1) 申请公布日期 2002.04.25
申请号 DE2001127268 申请日期 2001.06.05
申请人 SIEMENS AG 发明人 DOERFLER, HELMUT;MUELLER, HEIKO;RAITH, SEBASTIAN
分类号 H01L23/367;H05K1/02;H05K3/42;(IPC1-7):H05K7/20;H05K3/46 主分类号 H01L23/367
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