发明名称 |
Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path. |
摘要 |
A heat conductor path runs partly in an intermediate layer (11,12) conveying heat crosswise. A component (3) and a cooling element (6) are connected to the intermediate layer by electro-plating. The electro-plated contact forms a metal thermal through-contact (16). |
申请公布号 |
DE10127268(A1) |
申请公布日期 |
2002.04.25 |
申请号 |
DE2001127268 |
申请日期 |
2001.06.05 |
申请人 |
SIEMENS AG |
发明人 |
DOERFLER, HELMUT;MUELLER, HEIKO;RAITH, SEBASTIAN |
分类号 |
H01L23/367;H05K1/02;H05K3/42;(IPC1-7):H05K7/20;H05K3/46 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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