| 摘要 |
A preferred sputter target assembly ( 10, 10 ') comprises a target ( 12, 12 '), a backing plate ( 14, 14 ') bonded to the target ( 12, 12 ') along an interface ( 22, 22 ') and dielectric particles ( 20, 20 ') between the target ( 12, 12 ') and the backing plate ( 14, 14 '). A preferred method for manufacturing the sputter target assembly ( 10, 10 ') comprises the steps of providing the target ( 12, 12 ') and the backing plate ( 14, 14 '); distributing the dielectric particles ( 20, 20 ') between mating surfaces ( 24, 26 ) of the target ( 12, 12 ') and the backing plate ( 14, 14 '), most preferably along a sputtering track pattern on one of the mating surfaces; and bonding the target ( 12, 12 ') to the backing plate ( 14, 14 ') along the mating surfaces ( 24, 26 ). A preferred method for sputtering in accordance with the invention comprises the steps of applying electrical power to the sputter target ( 50, 160 ); causing the sputter target assembly ( 50, 160 ) to produce an electromagnetic signal (not shown) when a target end-of-life condition exists; and monitoring the sputter target assembly ( 50, 160 ) to detect the electromagnetic signal. |
