| 摘要 |
<p>An improved multi-chip module includes a circuit board (301) having an array of electrical interconnection pads to which are mounted a plurality of IC package units (201). Each IC package unit (201) includes multiple IC packages (105) which are mounted on opposite sides of a package carrier (101). The package units (201) may be mounted on one or both sides of the circuit board (301). A variety of package carriers are used to create a number of different modules. One type of package carrier (101) has a pair of major planar surfaces (102). Each planar surface (102) incorporates electrical contact pads (103). At least one IC package (105) is surface mounted on each major planar surface by interconnecting the conntection elements or leads (104) of the package (105) with contact pads (103) on the planar surface (102), to form the IC package unit (201). Another type of package carrier substrate has multiple recesses for back to back surface mounting of the IC packages. The packages also include in various versions heat sinks.</p> |
