| 摘要 |
The adhesion between a metal surface, e.g., a copper circuit trace, and a polymeric material, e.g., an epoxy insulator, is enhanced by treating the metal surface with a composition comprising: A. Hydrogen peroxide, B. An inorganic acid, e.g., a blend of sulfuric and phosphoric acids, C. A corrosion inhibitor, e.g., a triazole, D. A source of ammonium ion, e.g., ammonium phosphate, and F. Water. In a preferred embodiment, the treated metal surface is subsequently treated with a conditioner comprising: A. Hydrogen peroxide, B. An inorganic acid, e.g., sulfuric acid, C. A corrosion inhibitor, e.g., a triazole, D. An aromatic compound comprising a carboxlyic acid group, e.g., benzoic acid, and E. Water.
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