发明名称 Semiconductor materials, methods for fabricating semiconductor materials, and semiconductor devices
摘要 An insulating member (4) of an amorphous structure partially opened to expose a substrate (1; 1, 2, 3) is formed on the substrate. At least a compound semiconductor (5, 51, 52) containing at least nitrogen as a constituent element is deposited on the insulating member (4) and the substrate (40) exposed by the opening thereby to form a semiconductor material (1, 5, 51, 52). A semiconductor material (6, 7) configured of the first semiconductor material or configured of the first semiconductor material and another semiconductor material grown on the first semiconductor material is processed thereby to form a semiconductor device.
申请公布号 US6377596(B1) 申请公布日期 2002.04.23
申请号 US19980043384 申请日期 1998.03.18
申请人 HITACHI, LTD. 发明人 TANAKA TOSHIAKI;AOKI SHIGERU
分类号 H01L21/20;H01L33/00;H01L33/02;H01L33/06;H01L33/08;H01L33/10;H01L33/12;H01L33/14;H01L33/16;H01L33/20;H01L33/32;H01L33/34;H01L33/36;H01L33/46;H01S5/02;H01S5/183;H01S5/20;H01S5/223;H01S5/227;H01S5/323;H01S5/42;(IPC1-7):H01S5/20;H01L21/205;H01L29/04 主分类号 H01L21/20
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