| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has characteristics excellent in high temperature storage characteristics and solder cracking resistance. SOLUTION: The epoxy composition containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator and (D) melted silica powder as essential components is characterized in that the cured product of the epoxy resin composition exhibits a halogen ion content of <=1,000 ppm, when treated at 200 deg.C for 100 hr, crushed into the cured product having the maximum particle diameter of 100μm and an average particle diameter of 5 to 15μm and then subjected to a pressure cooker extraction, and has a glass transition temperature of <=150 deg.C.
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