发明名称 METHOD FOR HIGH FREQUENCY INDUCTION HEATING BOND OF BOARD BY LATTICE ELECTRODE
摘要 PROBLEM TO BE SOLVED: To provide a method for removing a trouble wherein in the case of manufacturing a door and a door of furniture by bonding a surface component 2 to a surface of a core material 1 such as a frame and a core board, when thermal bond is carried out by high frequency induction heating using a lattice electrode, heating traces are sometimes formed along an electrode position on the surface of the surface material 2. SOLUTION: A lattice electrode wherein a plurality of plus electrodes 4 and 4 and a plurality of minus electrodes 5 and 5 are arranged is brought in contact with a surface component of a material to be worked, and high frequency induction heating is carried out between partial plus electrodes 4 selected from a plurality of plus electrodes 4 and 4 and partial minus electrodes 5 selected from a plurality of minus electrodes 5 and 5. By changing selection of the plus electrode 4 and the minus electrode 5 which are applied to high frequency induction heating while bonding in thermal bond is completed, a part of the surface component 2 is avoided from being heated to a high temperature, and generation of heating marks is suppressed.
申请公布号 JP2002120208(A) 申请公布日期 2002.04.23
申请号 JP20000314978 申请日期 2000.10.16
申请人 YAMAMOTO VINITA CO LTD 发明人 YAMAMOTO TAIJI;KURAKI ITSUO;NAGATA TSUNEO
分类号 B27M1/08;B27M3/00;B29C65/04;B29C65/48;C09J5/06;C09J201/00;(IPC1-7):B27M1/08 主分类号 B27M1/08
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