Semiconductor chip package with multilevel leads

摘要

A semiconductor chip package includes a semiconductor chip having a plurality of contact pads, a plurality of first leads, a plurality of second leads and a housing. Each of the first leads includes an inner lead portion which is electrically coupled to an associated contact pad on the semiconductor chip, and an outer lead portion which extends from the inner lead portion and is exposed outside of the package. The second leads are disposed in an overlapping relationship with the first leads and are electrically insulated from the first leads. The second leads each include an inner lead portion electrically coupled to an associated contact pad on the semiconductor chip and an outer lead portion which extends from the inner lead portion and is exposed outside the package. The housing encapsulates the semiconductor chip and the inner lead portions of the plurality of first and second leads.