| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method for copper improving the chemical resistance of a copper circuit surface and adhesiveness between the copper surface and an insulating resin. SOLUTION: This surface treatment method consists in treating the copper surface with an aqueous solution containing an oxidizing agent to form an oxidized film, then subjecting the copper surface to immersion treatment in an aqueous solution containing sulfuric acid and further treating the copper surface with an aqueous solution consisting of formaldehyde and sodium hydroxide.
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