| 摘要 |
PROBLEM TO BE SOLVED: To provide an alignment mark that can achieve desired accuracy in alignment, and the manufacturing of a semiconductor device using the alignment mark. SOLUTION: A through-hole 26 passes extending from a first surface 23, where an element 25 of a substrate 22 in a semiconductor device 21 is formed, to a second surface 24 that is the back surface of the first surface 23. The through-hole 26 is filled with benzocyclobutene as resin 27, and the resin 27 projects from the second surface 24, thus using the through-hole 26 exposed onto the second surface 24 as an alignment mark 28, facilitating carrying out the alignment with naked eyes, and at the same time, improving the alignment accuracy.
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