METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To achieve an improved throughput and low cost in a semiconductor manufacturing step where a tape transfer is implemented. SOLUTION: The apparatus includes a transfer rail 17 for transferring a wide tape-like multiple chip substrate 16 having a plurality of semiconductor chips 1 mounted thereon in a widthwise direction, an air blower 19 for blowing air 19h from underside of the substrate 16 in the vicinity of central region of the widthwise direction of the substrate to vacuum suck the semiconductor chips 1 when the blowing of the air 19h is stopped, a lead bonder for connecting leads provided to the substrate 16 with electrode pads 1 of the chips 1 by means of inner lead bonding, and a bonding stage 18 for carrying the substrate 16. When the substrate 16 is transferred, the substrate 16 is prevented from bending downwards in a non-contact manner by blowing the air 19h from the air blower 19 toward the substrate 16.