发明名称 ORGANIC PLATING METHOD AND ORGANIC PLATED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a film having a controlled surface structure by accelerating a film forming speed when organic plating is applied on a metallic surface by using an electrolytic solution containing a triazine thiol derivative. SOLUTION: A solution obtained by mixing one or more kinds of triazine thiol derivatives shown in figure 1 is used as an electrolytic solution, and a metallic surface is electrochemically treated in the magnetic environment of 2,000 G (0.2 T) to 10 T, so that organic plating is performed thereto.
申请公布号 JP2002115098(A) 申请公布日期 2002.04.19
申请号 JP20000309542 申请日期 2000.10.10
申请人 JAPAN SCIENCE & TECHNOLOGY CORP 发明人 MORI KUNIO
分类号 C25D5/00;C25D9/02;C25D21/12;(IPC1-7):C25D9/02 主分类号 C25D5/00
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