发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device for using an element for promoting crystallization or a compound having the element, and for obtaining a crystalline silicon having superior productivity at a relatively high temperature and by heat treatment, using a laser beam. SOLUTION: An amorphous silicon film or one portion of the amorphous silicon film is brought into contact with the element for promoting crystallization, or the compound having the element. After that, the heat treatment is made, crystal growth is carried out from a portion that is brought into contact with the element or compound to a portion that is not brought into contact with the element or compound, and the silicon film having crystallizability is formed. Then, the laser beam or strong light is applied to the silicon film, and the irradiated silicon film is subjected to patterning and etched for obtaining an active layer. In the active layer, the portion in contact with the element or compound, and the tip of the crystal growth will not overlap with a channel forming region.</p>
申请公布号 JP2002118062(A) 申请公布日期 2002.04.19
申请号 JP20010214759 申请日期 2001.07.16
申请人 SEMICONDUCTOR ENERGY LAB CO LTD;SHARP CORP 发明人 OTANI HISASHI;MIYANAGA SHOJI;CHO KOYU;YAMAGUCHI NAOAKI;SUZUKI ATSUNORI
分类号 G02F1/1368;H01L21/20;H01L21/336;H01L27/08;H01L29/786;(IPC1-7):H01L21/20;G02F1/136 主分类号 G02F1/1368
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