| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a performance deterioration of semiconductor element can be prevented in the case of mounting the semiconductor element directly on a circuit forming body, and to provide a method for manufacturing the semiconductor device. SOLUTION: After the semiconductor element 102 and the circuit forming body 103 are oppositely faced, a resin material 106 is applied around the element 102 to join the element 102 to the body 103, thereby manufacturing the semiconductor device. In this case, in a gap 108 between the wiring face 102a of the element 102 and the mounting face 103a of the body 103 which are oppositely faced with each other, the wiring face is exposed to form a performance deterioration prevention space 107 for preventing deterioration in performance of the element. In this way, the wiring face contacts the performance deterioration prevention space and does not contact the resin material directly. Thus, the reflection or loss of signals of the element 102 can be prevented and the element can exhibit its design performance.</p> |
