发明名称 Method, for stamping openings into spaced layers, of a multi-layer profile, involves that as each opening is stamped the stamping is removed to give access to next layer below to be stamped
摘要 To stamp openings (12) in spaced material layers (11a-11c), of a profile (10) with at least three overlaid layers, the stamp punches the hole in each layer in succession. As each layer is stamped, the stamping (13) is removed to give access for the stamp to penetrate the next layer. The unwanted stamping is removed by a mechanical ejector or compressed air.
申请公布号 DE10036775(C1) 申请公布日期 2002.04.18
申请号 DE20001036775 申请日期 2000.07.28
申请人 AUTOLIV DEVELOPMENT AB, VAARGAARDA 发明人 MORSTADT, MARIO
分类号 B21D28/24;(IPC1-7):B21D28/02;B21D45/02 主分类号 B21D28/24
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