| 摘要 |
Decreasing foreign materials adhering to a semiconductor substrate to improve a yield and decreasing handling errors for the semiconductor substrate to improve an operating ratio of the semiconductor manufacturing apparatus. A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. These miconductor substrate is taken out of the container. An ionizer is used for static-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.
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